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  • ATS-52170B-C1-R0

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    The **ATS-52170B-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the "maxiFLOW™" series manufactured by Advanced Thermal Solutions (ATS). ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 17.0mm x 17.0mm | | **Height** | 7.5mm | | **Thermal Resistance** | 16.30°C/W (Unducted Flow) | --- ### 2. Design Characteristics This component is designed to dissipate heat from integrated circuits (ICs) and other electronic surface-mount devices (SMDs). * **Fin Geometry:** It features a **spread fin design**. Unlike traditional straight-fin sinks, the maxiFLOW™ geometry provides a larger surface area and maximizes airflow turbulence to increase heat transfer efficiency. * **pushPIN™ Attachment:** The "R0" suffix indicates the inclusion of a pushPIN™ mounting system. This uses a brass or plastic pin and a compression spring to provide a specific "holding force," ensuring consistent contact between the heat sink and the electronic component (usually paired with a Thermal Interface Material or TIM). * **Material properties:** The aluminum construction offers a balance between lightweight design and high thermal conductivity ($k \approx 205 \text{ W/mK}$). --- ### 3. Application Use Cases This specific heat sink is typically used in space-constrained environments where high-density electronics generate significant heat: 1. **Telecommunications:** Network switches and routers. 2. **Embedded Computing:** Small form-factor motherboards or industrial PCs. 3. **Power Electronics:** Voltage regulators or power MOSFETs. 4. **LED Cooling:** High-output small-array LEDs. --- ### 4. Part Number Breakdown The nomenclature follows a specific logic: ```text ATS - 52170 B - C1 - R0 | | | | | | | | | +-- Release/Revision Code | | | +------- Color/Finish (C1 = Blue Anodized) | | +----------- Profile/Fin Type | +-------------- Size Indicator (17mm x 17mm) +-------------------- Advanced Thermal Solutions ```
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this heat sink at specific air flow velocities?
    • ⤷ Which thermal interface materials are recommended for the ATS-52170B-C1-R0?
    • ⤷ What is the mechanical pressure exerted by the pushPIN™ attachment system on the PCB?