ATS-52170B-C1-R0
AI

The **ATS-52170B-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the "maxiFLOW™" series manufactured by Advanced Thermal Solutions (ATS).
### 1. Technical Specifications
The following table summarizes the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Attachment Method** | pushPIN™ |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W)** | 17.0mm x 17.0mm |
| **Height** | 7.5mm |
| **Thermal Resistance** | 16.30°C/W (Unducted Flow) |
---
### 2. Design Characteristics
This component is designed to dissipate heat from integrated circuits (ICs) and other electronic surface-mount devices (SMDs).
* **Fin Geometry:** It features a **spread fin design**. Unlike traditional straight-fin sinks, the maxiFLOW™ geometry provides a larger surface area and maximizes airflow turbulence to increase heat transfer efficiency.
* **pushPIN™ Attachment:** The "R0" suffix indicates the inclusion of a pushPIN™ mounting system. This uses a brass or plastic pin and a compression spring to provide a specific "holding force," ensuring consistent contact between the heat sink and the electronic component (usually paired with a Thermal Interface Material or TIM).
* **Material properties:** The aluminum construction offers a balance between lightweight design and high thermal conductivity ($k \approx 205 \text{ W/mK}$).
---
### 3. Application Use Cases
This specific heat sink is typically used in space-constrained environments where high-density electronics generate significant heat:
1. **Telecommunications:** Network switches and routers.
2. **Embedded Computing:** Small form-factor motherboards or industrial PCs.
3. **Power Electronics:** Voltage regulators or power MOSFETs.
4. **LED Cooling:** High-output small-array LEDs.
---
### 4. Part Number Breakdown
The nomenclature follows a specific logic:
```text
ATS - 52170 B - C1 - R0
| | | | |
| | | | +-- Release/Revision Code
| | | +------- Color/Finish (C1 = Blue Anodized)
| | +----------- Profile/Fin Type
| +-------------- Size Indicator (17mm x 17mm)
+-------------------- Advanced Thermal Solutions
```
- ⤷
What is the thermal resistance of this heat sink at specific air flow velocities?
- ⤷ Which thermal interface materials are recommended for the ATS-52170B-C1-R0?
- ⤷ What is the mechanical pressure exerted by the pushPIN™ attachment system on the PCB?