The **ATS-52190P-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 19.0mm x 19.0mm x 17.5mm | | **Thermal Resistance** | 5.80°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Brass/Plastic) | | **Interface Material** | T766 (Pre-applied Thermal Interface Material) | --- ### 2. Key Component Features #### A. The maxiFLOW™ Design The "P" in the part number often refers to the specific fin geometry. The maxiFLOW design features a flared fin structure that increases the surface area for heat dissipation and maximizes airflow through the fin field, which is critical for components in tight enclosures. #### B. pushPIN™ Attachment System This part utilizes the ATS **pushPIN™** system, which offers several advantages for PCB assembly: * **Compression Springs:** Provides a specific, consistent pressure to the component, ensuring optimal thermal contact. * **Ease of Install:** Allows for quick installation and removal without specialized tools. * **Secure Fit:** Prevents the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The model comes with **T766** pre-applied. This is a high-performance thermal grease or pad that fills the microscopic air gaps between the component surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic environments: 1. **Telecommunications:** Cooling network switches and routers. 2. **Industrial PCs:** Maintaining stability in high-temperature factory environments. 3. **Power Supplies:** Dissipating heat from high-speed switching transistors. ---