## ATS-52325P-C2-R0 Technical Overview The **ATS-52325P-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, specifically designed to cool electronic components like CPUs, GPUs, and other high-heat-generating integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-52325P-C2-R0 | | **Attachment Method** | pushPIN™ (Brass Pins) | | **Material** | Aluminum (Body), Copper (Optional slug variant) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 32.2mm x 32.2mm x 22.9mm | | **Thermal Resistance** | ~2.50 °C/W (at 200 LFM) | --- ### 2. Physical Design and Components The heat sink utilizes several specific electronic cooling design principles: * **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered shape to maximize surface area and improve airflow through the fin field, which reduces the "pressure drop" across the component. * **pushPIN™ Attachment:** Instead of messy thermal adhesives, this part uses a mechanical pushPIN™ system with a high-tension spring. This ensures consistent pressure across the thermal interface material (TIM). * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or a high-performance thermal pad to bridge the microscopic air gaps between the chip and the heat sink. --- ### 3. Thermal Performance Metrics The efficiency of the ATS-52325P-C2-R0 depends on the airflow (velocity measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 3.50 | | 200 | 2.50 | | 400 | 1.80 | | 600 | 1.45 | --- ### 4. Typical Applications This component is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling networking switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Supplies:** Heat dissipation for MOSFETs and power regulators. 4. **Computing:** Chipset cooling on motherboards. ---