The **ATS-52350P-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ## 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 17.50mm | | **Attachment Method** | pushPIN™ (Brass Pin with Stainless Steel Spring) | | **Thermal Resistance** | 3.20 °C/W (at 200 LFM) | | **Flow Direction** | Undirected (high-performance fin pattern) | --- ## 2. Key Electronic & Mechanical Features ### A. maxiFLOW™ Design The heat sink features a tapered fin design. This geometry is engineered to maximize surface area for heat dissipation while minimizing the pressure drop. In electronic systems with dense PCB layouts, this allows for better airflow through the sink even in "choked" environments. ### B. pushPIN™ Attachment Unlike simple adhesive tapes, the `ATS-52350P-C2-R0` utilizes a **pushPIN™** system: * **Reliability:** Ensures consistent pressure across the interface between the chip and the heat sink. * **Security:** Prevents the heat sink from shifting during vibration or shipping. * **Ease of Assembly:** Features a pre-assembled spring and pin that snaps into standard PCB holes. ### C. Thermal Interface Material (TIM) The unit typically comes with **ATS-PPS-02** or a similar high-performance thermal pad pre-applied to the base. This fills microscopic air gaps between the component and the heat sink to ensure efficient thermal conductivity. --- ## 3. Common Applications * **Networking Equipment:** Routers, switches, and base stations. * **Industrial Computing:** Embedded systems that require passive or forced-air cooling. * **Consumer Electronics:** High-end gaming consoles or media servers.