The **ATS-52400B-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" product line, designed specifically for high-density cooling requirements in electronic systems. --- ### 1. Technical Specifications The following table highlights the core mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 0.90 °C/W @ 200 LFM | | **Dimensions (L x W x H)** | 52.00mm x 52.00mm x 40.00mm | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Interface Material** | T766 (Thermal Tape/Phase Change) | | **Fin Style** | Tapered (maxiFLOW™) | --- ### 2. Key Electronic & Mechanical Design Features #### A. maxiFLOW™ Fin Geometry The "B" in the part number refers to the specific tapered fin design. Unlike standard straight-fin heat sinks, these fins flare outward. This design: * Reduces pressure drop. * Increases the surface area for heat dissipation. * Maximizes airflow through the heat sink in constrained spaces. #### B. maxiGRIP™ Attachment System This part utilizes a unique mechanical attachment system rather than permanent adhesive or drill holes: * **Plastic Frame Clip:** A frame snaps around the electronic component (usually a BGA or FPGA). * **Stainless Steel Spring Clip:** A "steady-spring" applies consistent pressure across the interface, ensuring maximum thermal transfer without damaging the chip. * **Reusability:** This allows for the heat sink to be removed and reattached during maintenance or rework. #### C. Thermal Interface Material (TIM) The unit comes pre-assembled with **T766**. This is a high-performance thermal pad that fills microscopic air gaps between the component die and the heat sink base, significantly lowering the contact resistance. --- ### 3. Common Applications Due to its size (52mm) and high thermal efficiency, the ATS-52400B-C2-R0 is typically found in: * **Telecommunications:** Network switches and high-speed routers. * **Processors:** Cooling Large Pin Grid Arrays (PGAs) and Ball Grid Arrays (BGAs). * **Industrial Computing:** Embedded systems where active fan cooling is limited, and passive or forced-air heat sinks must be highly efficient. ---