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  • ATS-52450G-C2-R0

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    The **ATS-52450G-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.50mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Design Components The ATS-52450G-C2-R0 is not just a block of metal; it incorporates several specialized design features: * **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered, spread-fin pattern. This maximizes surface area for heat dissipation while minimizing the pressure drop as air passes through the unit. * **maxiGRIP™ Attachment:** This is a mechanical attachment system. It consists of a plastic frame clip and a stainless steel "X-clip." It allows for high assembly pressure without the need to drill holes into the Printed Circuit Board (PCB). * **Thermal Interface Material (TIM):** The part comes pre-applied with **T766** thermal tape. This ensures efficient heat transfer from the electronic component (heat source) to the aluminum heat sink. --- ### 3. Applications and Compatibility This part is typically used in environments where air-flow is present (forced convection) and space is a constraint. * **Typical Components:** BGA (Ball Grid Array) packages, CPUs, GPUs, and high-speed networking chips. * **Industries:** Telecommunications, data centers, aerospace, and high-end computing. * **Mounting:** It is designed for 45mm x 45mm chips. The blue anodized coating not only provides corrosion resistance but also improves thermal radiation and aesthetic identification. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between the maxiGRIP and traditional screw-mount heat sinks?
    • ⤷ How does the T766 thermal tape compare to thermal paste in performance?
    • ⤷ What is the maximum power dissipation (Watts) this heat sink can handle?