ATS-52450G-C2-R0
AI

The **ATS-52450G-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 12.50mm |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 2.50°C/W (at 200 LFM) |
| **Attachment Method** | maxiGRIP™ (Frame Clip) |
| **Interface Material** | T766 (Thermal Tape) |
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### 2. Key Design Components
The ATS-52450G-C2-R0 is not just a block of metal; it incorporates several specialized design features:
* **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered, spread-fin pattern. This maximizes surface area for heat dissipation while minimizing the pressure drop as air passes through the unit.
* **maxiGRIP™ Attachment:** This is a mechanical attachment system. It consists of a plastic frame clip and a stainless steel "X-clip." It allows for high assembly pressure without the need to drill holes into the Printed Circuit Board (PCB).
* **Thermal Interface Material (TIM):** The part comes pre-applied with **T766** thermal tape. This ensures efficient heat transfer from the electronic component (heat source) to the aluminum heat sink.
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### 3. Applications and Compatibility
This part is typically used in environments where air-flow is present (forced convection) and space is a constraint.
* **Typical Components:** BGA (Ball Grid Array) packages, CPUs, GPUs, and high-speed networking chips.
* **Industries:** Telecommunications, data centers, aerospace, and high-end computing.
* **Mounting:** It is designed for 45mm x 45mm chips. The blue anodized coating not only provides corrosion resistance but also improves thermal radiation and aesthetic identification.
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- ⤷
What is the difference between the maxiGRIP and traditional screw-mount heat sinks?
- ⤷ How does the T766 thermal tape compare to thermal paste in performance?
- ⤷ What is the maximum power dissipation (Watts) this heat sink can handle?