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  • ATS-53170B-C1-R0

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    The **ATS-53170B-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs. ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Part Number** | ATS-53170B-C1-R0 | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 17mm x 17mm x 7.5mm | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 12.3 °C/W (at 200 LFM) | | **Flow Pattern** | Spread Fin (High Performance) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Electronic Features * **maxiFLOW™ Design:** The heat sink features a tapered fin design that maximizes surface area and optimizes airflow. This is critical for cooling high-density electronics where space is limited but heat output is high. * **maxiGRIP™ Attachment:** Unlike traditional adhesive methods, this uses a steady-force spring clip. This ensures a consistent pressure on the electronic chip, improving thermal transfer without the risk of the heat sink falling off due to vibration or thermal expansion. * **EMI Shielding Compatibility:** The design allows for the heat sink to be mounted without drilling holes into the PCB, preserving signal integrity and reducing electromagnetic interference (EMI) risks. --- ### 3. Application Use Cases This specific part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling small-form-factor networking chips. 2. **Embedded Systems:** Industrial PCs where vertical clearance is limited (only 7.5mm high). 3. **Power Electronics:** Managing heat for localized power regulators or small high-speed microcontrollers. --- ### 4. Mounting Diagram Logic ```markdown [ PCB Surface ] | [ Electronic Chip (e.g., BGA) ] | [ Thermal Interface Material (T766) ] | [ ATS-53170B-C1-R0 Heat Sink ] | [ maxiGRIP™ Plastic Frame Clip ] ```
    ✨ Follow-up Questions
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ What is the specific airflow requirement to reach a thermal resistance of 5.0 °C/W?
    • ⤷ Are there taller versions of the ATS-53170 series for better cooling?