ATS-53170B-C1-R0
AI

The **ATS-53170B-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs.
### 1. Technical Specifications
The following table highlights the primary physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Part Number** | ATS-53170B-C1-R0 |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 17mm x 17mm x 7.5mm |
| **Attachment Method** | maxiGRIP™ (Frame Clip) |
| **Thermal Resistance** | 12.3 °C/W (at 200 LFM) |
| **Flow Pattern** | Spread Fin (High Performance) |
| **Interface Material** | T766 (Thermal Tape) |
---
### 2. Key Electronic Features
* **maxiFLOW™ Design:** The heat sink features a tapered fin design that maximizes surface area and optimizes airflow. This is critical for cooling high-density electronics where space is limited but heat output is high.
* **maxiGRIP™ Attachment:** Unlike traditional adhesive methods, this uses a steady-force spring clip. This ensures a consistent pressure on the electronic chip, improving thermal transfer without the risk of the heat sink falling off due to vibration or thermal expansion.
* **EMI Shielding Compatibility:** The design allows for the heat sink to be mounted without drilling holes into the PCB, preserving signal integrity and reducing electromagnetic interference (EMI) risks.
---
### 3. Application Use Cases
This specific part is typically used in the following electronic environments:
1. **Telecommunications:** Cooling small-form-factor networking chips.
2. **Embedded Systems:** Industrial PCs where vertical clearance is limited (only 7.5mm high).
3. **Power Electronics:** Managing heat for localized power regulators or small high-speed microcontrollers.
---
### 4. Mounting Diagram Logic
```markdown
[ PCB Surface ]
|
[ Electronic Chip (e.g., BGA) ]
|
[ Thermal Interface Material (T766) ]
|
[ ATS-53170B-C1-R0 Heat Sink ]
|
[ maxiGRIP™ Plastic Frame Clip ]
```
- ⤷
How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ What is the specific airflow requirement to reach a thermal resistance of 5.0 °C/W?
- ⤷ Are there taller versions of the ATS-53170 series for better cooling?