The **ATS-53170R-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed primarily for cooling high-power electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 37.00mm x 37.00mm x 14.50mm | | **Thermal Resistance** | 3.50 °C/W (at 200 LFM) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Compliance** | RoHS Compliant | | **Fin Style** | Straight Fin | --- ### 2. Key Design Components The "Electronic" nature of this part refers to its integration into PCB assemblies. It consists of three primary elements: #### A. The maxiFLOW™ Heat Sink The geometry features a tapered fin design. This increases the surface area while decreasing air resistance, allowing for maximum heat dissipation in high-velocity airflow environments. #### B. The maxiGRIP™ Attachment Instead of using messy thermal epoxies or permanent pins, this part uses a **plastic frame clip**. * **Plastic Frame:** Fits around the electronic component on the PCB. * **Stainless Steel Spring Clip:** Applies steady, even pressure across the surface of the chip. * **Benefit:** This allows for easy removal or replacement without damaging the PCB or the component. #### C. Thermal Interface Material (TIM) The base of the ATS-53170R-C1-R0 typically comes pre-applied with a high-performance **Phase Change Material (PCM)**. This ensures that the microscopic gaps between the chip and the heat sink are filled, minimizing thermal resistance. --- ### 3. Typical Applications This heat sink is specifically sized for components with a footprint of roughly 37mm x 37mm. Typical use cases include: * **Telecommunications Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial motherboards. * **Power Supplies:** Cooling voltage regulators or power modules.