The **ATS-53190P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-53190P-C1-R0 | | **Material** | Aluminum | | **Dimensions (L x W x H)** | 19.0mm x 19.0mm x 17.5mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.50 °C/W (at 200 LFM) | | **Fin Style** | maxiFLOW (Tapered Fin) | | **Finish** | Blue Anodized | | **Interface Material** | T766 (High performance) | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The fins are tapered and angled. This design reduces pressure drop and increases the surface area exposed to airflow, making it highly efficient for forced convection environments. * **pushPIN™ Attachment:** It uses a spring-loaded pin mechanism. This ensures consistent pressure across the interface of the electronic component, which optimizes thermal transfer and prevents damage from mechanical shock. * **Thermal Interface Material (TIM):** It comes pre-applied with **T766**, a high-performance thermal phase-change material. This eliminates the need for manual application of thermal paste and ensures a low thermal resistance path. * **Blue Anodized Finish:** This provides extra surface protection against corrosion and enhances thermal radiation characteristics. ### 3. Application Use-Cases This heat sink is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Managing heat for voltage regulators and power converters. --- ### 4. Thermal Performance Comparison The effectiveness of the ATS-53190P-C1-R0 is dependent on the Airflow (Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 6.50 | | 300 | 5.20 | | 400 | 4.60 | | 500 | 4.10 |