The **ATS-53310P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for high-efficiency cooling of electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Length/Width** | 33.00 mm x 33.00 mm | | **Height** | 10.00 mm | | **Thermal Resistance** | 3.60°C/W (at 200 LFM) | | **Attachment Method** | Push Pin (Plastic) | | **Interface Material** | Thermal Pad (pre-applied) | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The heat sink features a unique "flared fin" design. This geometry increases the surface area for heat dissipation while maximizing airflow through the fin field, which reduces the pressure drop. * **Push-Pin Attachment:** The `P` in the part number denotes a **Push Pin** mounting system. This provides a secure, reliable attachment to the PCB with a consistent compression force, improving the efficiency of the Thermal Interface Material (TIM). * **Material and Coating:** It is made from extruded aluminum with a black anodized finish. The black coating increases thermal emissivity, slightly improving performance in natural convection scenarios. * **Thermal Interface Material (TIM):** This part usually comes with a pre-applied high-performance thermal pad, reducing assembly time and ensuring a clean contact between the component and the heat sink. --- ### 3. Applications and Usage This part is typically used in space-constrained electronic environments where reliable thermal management is critical: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Supplies:** Heat dissipation for MOSFETs or power regulators. 4. **Processors:** Cooling for ARM-based SOCs or small-form-factor FPGAs. --- ### 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **53310** | Dimensions (roughly 33x33x10mm) | | **P** | Attachment Type (Push Pin) | | **C1** | Thermal Interface Material Code | | **R0** | RoHS Compliant / Revision code |