The **ATS-53325P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for cooling electronic components such as CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table highlights the core mechanical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 32.2mm x 32.2mm | | **Height** | 17.5mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Interface Material** | T766 (Thermal Phase Change Material) | | **Thermal Resistance** | 3.50 °C/W (at 200 LFM) | --- ### 2. Key Design Components #### A. The maxiFLOW™ Fin Geometry The "P" in the part number often refers to the specific flared fin geometry. Unlike straight-fin heat sinks, these fins are tapered and angled to: * Increase surface area for heat dissipation. * Reduce pressure drop. * Maximize airflow efficiency in constrained spaces. #### B. Attachment System (Push-Pin) This model uses a **push-pin and spring** mounting mechanism. * **Reliability:** It provides consistent pressure (Load) onto the electronic component, which is critical for maximizing thermal transfer. * **Ease of Use:** It allows for quick installation into pre-drilled holes on a PCB (Printed Circuit Board). #### C. Pre-Applied Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material that softens as the chip heats up, filling microscopic air gaps between the chip surface and the heat sink base to ensure optimal thermal conductivity. --- ### 3. Application Use-Cases This heat sink is typically found in: 1. **Networking Hardware:** Routers, switches, and gateways where airflow might be multidirectional. 2. **Embedded Systems:** Industrial PCs or controllers where passive cooling needs to be supplemented by system fans. 3. **High-Speed Computing:** Cooling voltage regulators or smaller processors on motherboards. --- ### 4. Thermal Performance Profile The efficiency of the ATS-53325P-C1-R0 is highly dependent on the air velocity (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 3.50 | | 300 | 2.80 | | 400 | 2.40 | | 500 | 2.10 |