The **ATS-53350D-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-53350D-C1-R0 | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions (L x W x H)** | 35mm x 35mm x 9.5mm | | **Attachment Method** | Push-Pin (2-pin configuration) | | **Thermal Resistance** | 5.30° C/W (at 200 LFM) | | **Interface Material** | T766 (High-performance Phase Change Material) | --- ### 2. Key Electronic & Mechanical Features #### A. maxiFLOW™ Fin Geometry The "D" in the part number refers to a specific fin profile. The maxiFLOW™ design features a flared fin structure that increases the surface area for maximum heat dissipation while maintaining a low pressure drop. This is critical in electronics where airflow is restricted by other components on a PCB. #### B. Attachment Mechanism: Push-Pins Unlike adhesive tapes, this heat sink uses a **Brass Push-Pin** with a stainless steel spring. * **Benefits:** Provides constant, uniform pressure on the electronic chip, which optimizes the contact between the die and the heat sink. * **Reliability:** It is vibration-resistant and ensures the heat sink remains attached during thermal cycling (expansion and contraction). #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 phase change material**. * **Function:** This material fills the microscopic air gaps between the chip surface and the heat sink base. * **Behavior:** At operating temperatures, it softens to create a low-resistance thermal path, significantly improving cooling efficiency compared to standard pads. --- ### 3. Application Use Cases This component is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Computing:** Industrial PC processors where active fan cooling is not feasible. 3. **Power Supplies:** Regulating temperature in high-density power modules. ---