The **ATS-53350P-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 17.5mm | | **Attachment Method** | Push-Pin (2-Pin) | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 2.50 °C/W (at 200 LFM) | | **Pressure Drop** | 0.14 inH2O (at 200 LFM) | --- ### 2. Key Electronic & Design Features #### A. Thermal Management Design The unit utilizes a **tapered fin design**, which is characteristic of the maxiFLOW™ series. This design increases the surface area for heat dissipation while maximizing airflow through the fins, making it ideal for high-density electronic boards where space is limited. #### B. Attachment Mechanism (Push-Pin) The "P" in the part number indicates a **Push-Pin** attachment. * **Spring-loaded Pins:** These ensure a specific amount of force (clamping pressure) is applied to the electronic component, which improves the thermal interface material (TIM) performance. * **Reliability:** Unlike adhesive tapes, push-pins provide a secure mechanical connection that survives high-vibration environments. #### C. Thermal Interface Material (TIM) The ATS-53350P-C1-R0 usually comes with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad. This ensures optimal thermal transfer between the chip (heat source) and the aluminum base of the heat sink. --- ### 3. Common Applications This heat sink is typically found in the following electronic sectors: 1. **Telecommunications:** High-speed routers and networking switches. 2. **Industrial Computing:** Embedded systems that operate in harsh thermal environments. 3. **Data Centers:** Cooling of power-management chips on server motherboards.