The **ATS-53350R-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-53350R-C1-R0 | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 24.50mm | | **Material** | Aluminum | | **Fin Style** | maxiFLOW™ (Tapered Fin) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 2.00 °C/W @ 200 LFM | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Electronic Design Features #### A. maxiFLOW™ Fin Geometry The "R" in the part number often refers to the specific fin pattern. The maxiFLOW design uses a spread-fin geometry that increases surface area while reducing pressure drop. This is critical for electronic enclosures where airflow might be limited or directional. #### B. maxiGRIP™ Attachment System One of the most important aspects for PCB design is how it attaches to the electronic component: * **Plastic Frame Clip:** It uses a four-finger clip that wraps around the component. * **Mechanical Stability:** It provides high assembly pressure without needing holes in the PCB, which preserves signal integrity on dense boards. * **Thermal Interface:** It comes pre-applied with **Phase Change Material (PCM)** or thermal tape (T766), ensuring a low-resistance thermal path from the silicon die to the aluminum fins. #### C. Material and Coating * **Aluminum:** Provides a balance between thermal conductivity and weight. * **Black Anodized Finish:** The "C1" designation usually refers to the finish. Black anodization increases emissivity, which improves heat dissipation via radiation in addition to convection. --- ### 3. Application Use-Cases This heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed switching silicon. 2. **Embedded Systems:** Industrial PCs where vertical space (24.5mm) is available. 3. **Power Supplies:** Cooling MOSFET arrays or power modules that fit a 35mm footprint. --- ### 4. Thermal Performance Summary In a forced convection environment (airflow), the performance scales as follows: ```text Airflow Velocity (LFM) | Thermal Resistance (°C/W) -----------------------|------------------------- 200 LFM | 2.0 300 LFM | 1.6 400 LFM | 1.4 500 LFM | 1.2 ``` ---