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  • ATS-53450R-C1-R0

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    The **ATS-53450R-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **maxiFLOW™** series, designed specifically for cooling electronic components like processors, FPGAs, and ASICs in high-airflow environments. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 14.50mm | | **Thermal Resistance** | 1.80°C/W (at 200 LFM) | | **Material** | Aluminum (Anodized) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Design Features * **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered, spread-fin pattern. This increases the surface area for heat dissipation while maintaining a low pressure drop, making it ideal for systems with high-velocity airflow. * **maxiGRIP™ Attachment:** It uses a unique mechanical frame clip system. This provides high mounting pressure without requiring holes in the PCB, ensuring better thermal contact and preventing the heat sink from shifting during vibration or shock. * **Material and Finish:** Constructed from high-grade aluminum with a black anodized finish, which improves thermal radiation and protects against corrosion. --- ### 3. Electronic Application This part is typically used in the following electronic contexts: 1. **Telecommunications:** Cooling networking chips in switches and routers. 2. **High-Performance Computing:** Dissipating heat from chipsets on motherboards or expansion cards. 3. **Power Supplies:** Managing thermal loads in compact power conversion modules. --- ### 4. Installation Overview The assembly consists of three primary components: 1. **The Heat Sink:** The main aluminum body. 2. **The Frame Clip:** A plastic frame that surrounds the electronic component. 3. **The Spring Clip:** A metal wire that secures the heat sink to the frame.
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this heat sink at different airflow speeds (LFM)?
    • ⤷ How does the maxiGRIP attachment compare to standard push-pin mounting?
    • ⤷ Is the T766 thermal interface material pre-applied to the ATS-53450R-C1-R0?