The **ATS-54170R-C1-R0** is a high-performance heat sink component designed by Advanced Thermal Solutions (ATS). It is specifically engineered for cooling electronic components like CPUs, GPUs, or BGA (Ball Grid Array) packages. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Parameter | Value / Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Attachment Method** | maxiGRIP™ (Steady spring clip) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 17.00mm | | **Material** | Aluminum | | **Finish** | Black Anodized | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | --- ### 2. Key Design Features * **maxiFLOW™ Fin Geometry:** The fins feature a high-aspect-ratio design that increases surface area while reducing pressure drop. This allows for more efficient heat dissipation in systems with forced-air cooling. * **maxiGRIP™ Attachment:** This is a specialized mechanical attachment system. It uses a plastic frame clip and a stainless steel "pedestal" spring. * It applies steady, even pressure to the component. * It eliminates the need to drill holes in the PCB. * It is easily removable for maintenance or rework. * **Thermal Interface Material (TIM):** The part typically comes with pre-applied **Chomerics T766** phase-change material, which ensures a low-resistance thermal path between the chip and the heat sink. --- ### 3. Application Use Cases This specific model is commonly used in: 1. **Telecommunications:** Cooling high-speed networking chips and routers. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Electronics:** Managing heat for voltage regulators or high-end chipsets. --- ### 4. Thermal Performance Data *Note: Performance varies based on the Airflow (LFM - Linear Feet per Minute).* | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 2.50 | | 300 | 2.00 | | 400 | 1.80 | | 500 | 1.60 |