The **ATS-54190R-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The table below outlines the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Passive/Active Thermal Management) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 19.00mm | | **Mounting Style** | pushPIN™ (Spring-loaded pins) | | **Attachment Method** | Plastic Push Pins (with Stainless Steel Springs) | | **Thermal Resistance** | ~1.60°C/W (at 200 LFM) | | **Interface Material** | T766 (High Performance Phase Change) | --- ### 2. Key Electronic & Design Components #### A. The Fin Geometry (maxiFLOW™) The "R" in the part number refers to the **Flared Fin** design. Unlike standard straight-cut heat sinks, these fins flare outward. This increases the surface area and promotes better airflow transition from the fan to the heat sink, significantly reducing thermal resistance in high-airflow environments. #### B. The pushPIN™ Attachment System This part uses a specific mechanical attachment system rather than adhesive tape. * **Plastic Pins:** Specifically designed for pre-drilled holes in the PCB. * **Compression Springs:** These ensure a consistent and precise pressure is applied to the electronic chip, which is critical for maximizing the efficiency of the thermal interface material (TIM). #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. In electronics, the TIM is crucial because it fills microscopic air gaps between the heat sink and the semiconductor die. T766 is a "phase-change" material that softens at operating temperatures to create a high-conductivity thermal bridge. --- ### 3. Applications in Electronics * **Telecommunications:** Used on high-speed networking switches and routers. * **Data Centers:** Ideal for cooling power-dense processors on server blades. * **Embedded Systems:** Suitable for industrial computers where vibration resistance is needed (the push-pins offer more stability than glue). ---