The **ATS-54210W-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Dimensions (L x W x H)** | 42.4mm x 42.4mm x 24.5mm | | **Thermal Resistance** | 1.1 °C/W (@ 200 LFM) | | **Flow Pattern** | Spread Fin (maxiFLOW™) | | **Compliance** | RoHS Compliant | --- ## 2. Key Electronic & Mechanical Features ### A. maxiFLOW™ Fin Design Unlike standard straight-fin heat sinks, the **maxiFLOW™** geometry features a tapered fin design. This reduces pressure drop and increases surface area, allowing for higher thermal efficiency in systems with low-to-medium airflow. ### B. maxiGRIP™ Attachment One of the most critical aspects of this part is the **maxiGRIP™** assembly: - **Steady Pressure:** It uses a high-performance plastic frame clip and a gold-colored spring clip to apply uniform pressure across the component. - **No Holes Required:** It attaches directly to the component (like a BGA package), meaning you do not need to drill holes in the Printed Circuit Board (PCB). - **Thermal Interface Material (TIM):** It typically comes with a pre-applied high-performance thermal pad (e.g., Chomerics T766) to ensure low thermal resistance between the chip and the metal. ### C. Application Environment This part is engineered for high-density electronic environments: * **Telecommunications:** Networking switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Data Centers:** Server-grade processors requiring small footprint cooling. --- ## 3. Thermal Performance Reference Thermal resistance ($\theta$) is measured in Celsius per Watt (°C/W). Lower values indicate better heat dissipation. * **@ 200 LFM (Linear Feet per Minute):** 1.1 °C/W * **@ 400 LFM:** 0.8 °C/W * **@ 600 LFM:** 0.6 °C/W ---