The **ATS-54250D-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling electronic components like processors, FPGAs, and ASICs that require efficient heat dissipation in constrained environments. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 54mm x 54mm x 9.5mm | | **Thermal Resistance** | 2.10 °C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Shape** | Square (Finned) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Design The ATS-54250D-C2-R0 is engineered with specific electronic cooling goals in mind: * **maxiFLOW™ Fin Design:** The unique flared fin structure increases surface area and improves air turbulence. This maximizes heat transfer compared to traditional straight-fin designs. * **pushPIN™ Attachment:** It uses a spring-loaded mechanism that ensures consistent pressure between the heat sink and the electronic component, which is critical for maintaining thermal conductivity. * **Low Profile:** With a height of only 9.5mm, it is suitable for low-clearance applications such as 1U servers or thin networking equipment. * **Pre-applied TIM:** It comes with **T766 phase-change material**, which fills microscopic air gaps between the chip and the heat sink base, significantly reducing thermal resistance upon the first heat cycle. --- ### 3. Applications in Electronics This component is typically found in the following hardware: 1. **Networking:** Switches, routers, and high-speed modems. 2. **Computing:** Embedded systems, industrial PCs, and GPU/FPGA cooling. 3. **Power Electronics:** Cooling for high-density power modules and voltage regulators.