The **ATS-54350W-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling electronic components that require efficient thermal dissipation in restricted spaces. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Category** | Passive Cooling / Heat Sink | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 0.90 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 54mm x 54mm x 35mm | | **Attachment Method** | maxiGRIP™ (Spring-clip) | | **Interface Material** | T766 (Thermal Tape/Phase Change) | --- ### 2. Design and Component Breakdown #### A. The maxiFLOW™ Fin Geometry The fins are designed with a tapered, "flared" geometry. Unlike standard straight-fin heat sinks, this design increases the surface area for heat radiation while maintaining low pressure drop, making it highly effective in high-velocity airflow environments. #### B. The maxiGRIP™ Attachment System This part utilizes a unique mechanical attachment system: * **Plastic Frame Clip:** A frame that snaps around the electronic component (usually a BGA/FPGA). * **Stainless Steel Spring:** A "C-clip" that applies consistent pressure to the heat sink, ensuring optimal contact with the chip. * **Benefit:** This prevents "tilting" of the heat sink and allows for easy removal/rework without damaging the PCB or the chip. #### C. Material Composition * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodize:** The finish is not just aesthetic; anodizing improves emissivity (radiation heat transfer) and provides a protective layer against corrosion. --- ### 3. Applications in Electronics This specific part is typically found in high-heat density electronic systems, including: 1. **Telecommunications:** Network switches and routers. 2. **Computing:** High-speed processors, FPGAs (Field Programmable Gate Arrays), and ASICs. 3. **Industrial:** Power supplies and motor controllers that require stable thermal management to avoid throttling or failure. --- ### 4. Thermal Performance Comparison *At various airflows (Linear Feet per Minute):* | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 0.90 | | 300 | 0.70 | | 400 | 0.60 | | 500 | 0.55 |