The **ATS-54375D-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from the **maxiFLOW™** series manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its technical specifications and physical characteristics. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-54375D-C1-R0 | | **Type** | Board Level / Component Heat Sink | | **Attachment Method** | Push-Pin (2-Pin) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.50°C/W @ 200 LFM (Linear Feet per Minute) | --- ## 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding components. * **Length:** 37.00 mm * **Width:** 37.00 mm * **Height (Fin Depth):** 9.50 mm * **Pin-to-Pin Distance:** 43.00 mm --- ## 3. Key Design Features ### maxiFLOW™ Fin Geometry The "D" in the part number signifies the specific fin design. The maxiFLOW series uses a **tapered fin design** which: * Reduces pressure drop. * Increases the surface area for maximum heat dissipation. * Optimizes airflow in constrained spaces. ### Attachment Mechanism: Push-Pins The **C1-R0** suffix indicates the mounting hardware provided: * **Push-Pins:** Plastic or brass pins with a compression spring. * **Reliability:** Provides consistent pressure on the component (e.g., a BGA or FPGA) to ensure high thermal conductivity through the Thermal Interface Material (TIM). * **TIM:** This specific part usually comes pre-applied with high-performance **Phase Change Material** or thermal tape. ### Material & Finish * **Aluminum:** Lightweight and offers excellent thermal conductivity. * **Blue Anodized:** This is not just for aesthetics; the anodized coating provides surface protection against corrosion and increases thermal emissivity. --- ## 4. Typical Applications This heat sink is designed for cooling high-power electronic components such as: 1. **FPGAs & ASICs:** Used in telecommunications and data centers. 2. **Processors:** Low-profile CPUs in industrial computing. 3. **Video chips:** Graphics processing units in embedded systems.