The **ATS-54375W-C1-R0** is a high-performance thermal management component, specifically a **Heat Sink** from the *maxiFLOW™* series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications and electronic/mechanical characteristics. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 1.10°C/W @ 200 LFM | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 24.50mm | --- ### 2. Design and Engineering Features The ATS-54375W-C1-R0 is engineered for cooling high-power electronic components like FPGAs, CPUs, and GPUs. #### A. The maxiFLOW™ Fin Geometry Unlike standard straight-fin heat sinks, the maxiFLOW™ design features a **tapered fin structure**. * **Purpose:** This increases the surface area for heat dissipation while reducing the pressure drop of the airflow passing through it. * **Result:** Highly efficient cooling in forced-convection (fan-cooled) environments. #### B. The maxiGRIP™ Attachment System This part uses a specialized mechanical attachment system: * **Frame Clip:** A plastic frame attaches to the component/PCB. * **Spring Clip:** A "steady-spring" steel clip applies consistent pressure across the center of the heat sink. * **Benefit:** This avoids the need for drilling holes in the PCB and allows for easy removal or re-work without damaging the board. #### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the unit typically comes with a **pre-applied thermal interface material** (usually Chomerics T766). This ensures a low-resistance thermal path between the electronic component (heat source) and the aluminum sink. --- ### 3. Thermal Performance Profile Thermal performance is measured by how much the temperature rises per Watt of power. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM (1.0 m/s)** | 1.10 | | **300 LFM (1.5 m/s)** | 0.90 | | **400 LFM (2.0 m/s)** | 0.70 | | **600 LFM (3.0 m/s)** | 0.60 | --- ### 4. Typical Applications * **Networking Gear:** High-speed switches and routers. * **Data Centers:** Server processors. * **Industrial Power Supplies:** Cooling power MOSFETs or IGBTs. * **Telecommunications:** Base station signal processing units. ---