The **ATS-54400D-C2-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it belongs to the **maxiFLOW™** family of heat sinks designed for cooling electronic components such as BGAs, CPUs, and GPUs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | maxiGRIP™ (Spring-clip assembly) | | **Length / Width** | 54.00 mm x 54.00 mm | | **Height** | 9.50 mm | | **Thermal Resistance** | 1.80 °C/W @ 200 LFM (Airflow) | | **RoHS Status** | Compliant | --- ### 2. Key Electronic & Mechanical Parts The assembly is more than just a piece of metal; it consists of a specialized system to ensure reliable cooling: #### A. The Heat Sink (The Core) * **maxiFLOW™ Geometry:** Features a tapered fin design that maximizes surface area and improves airflow intake. This reduces the "pressure drop" compared to standard straight-fin heat sinks. * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. #### B. maxiGRIP™ Attachment System * **Plastic Frame Clip:** A high-strength plastic frame that surrounds the electronic component (e.g., a processor). * **Stainless Steel Spring Clip:** A "steady-force" spring that snaps over the heat sink and hooks into the frame clip. This ensures consistent downward pressure (interfacial pressure) without requiring holes in the PCB. #### C. Thermal Interface Material (TIM) * **Pre-applied Phase Change Material:** This part usually comes with a pre-applied thermal pad or grease (typically Chomerics T766 or similar). When the electronic part heats up, the TIM softens to fill microscopic air gaps between the chip and the heat sink. --- ### 3. Application Use Cases This specific heat sink size (54mm) is typically used for cooling high-power logic devices: 1. **Telecommunications:** Network switches and high-speed routers. 2. **Data Centers:** Server CPUs or specialized ASIC chips. 3. **Industrial Computing:** Embedded systems that require rugged, vibration-resistant mounting (provided by the maxiGRIP™ system). ---