The **ATS-54425R-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like CPUs, GPUs, and ASICs in high-airflow environments. --- ### 1. Technical Specifications Below are the primary mechanical and thermal specifications for this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | 1.1 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 42.5mm x 42.5mm x 24.5mm | | **Fin Style** | Straight / Tapered (maxiFLOW™) | | **Interface Material** | T766 (Thermal Tape/Grease) | --- ### 2. Key Design Components #### A. maxiFLOW™ Fin Geometry The "R" in the part number often refers to the specific profile of the fins. The maxiFLOW™ design features a flared fin structure. This increases the surface area and creates more turbulence in the air, which helps dissipate heat more effectively than standard straight-fin heat sinks. #### B. maxiGRIP™ Attachment System The **-C2** designation typically relates to the attachment hardware. * **Plastic Frame Clip:** It uses a high-strength plastic frame that clips around the component. * **Stainless Steel Spring:** A "steady-force" spring clip applies consistent pressure across the center of the heat sink. * **No Holes Required:** This system does not require holes in the PCB, which is critical for high-density board designs. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with a thermal interface material (T766). This ensures that microscopic air gaps between the component surface and the heat sink base are filled, minimizing thermal resistance. --- ### 3. Application Use-Cases This specific heat sink is typically used for cooling: 1. **BGA (Ball Grid Array) Packages:** Its 42.5mm footprint is a standard size for many mid-to-high power FPGAs and processors. 2. **Network Switches:** Used in rack-mounted equipment where forced-air cooling (fans) is present. 3. **Industrial Controllers:** Where high reliability and vibration resistance (provided by the maxiGRIP clip) are necessary. --- ### 4. Part Number Breakdown * **ATS:** Manufacturer (Advanced Thermal Solutions). * **54425:** Series and physical dimensions (42.5mm). * **R:** maxiFLOW™ flared fin geometry. * **C2:** Indicates the specific attachment clip/hardware version. * **R0:** Revision code or standard packaging indicator.