The **ATS-55170K-C1-R0** is a high-performance thermal management component, specifically a heat sink from the **maxiFLOW™** series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its electronic and physical specifications. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-55170K-C1-R0 | | **Product Series** | maxiFLOW™ | | **Attachment Method** | **pushPIN™** (Provides secure, consistent pressure) | | **Thermal Resistance (Flow)** | ~2.60 °C/W @ 200 LFM | | **Material** | Aluminum (Black Anodized) | | **Dimensions (L x W x H)** | 17mm x 17mm x 14.5mm | --- ### 2. Key Design Features #### A. maxiFLOW™ Geometry The "K" in the part number indicates a specific fin pattern. Unlike traditional straight-fin heat sinks, the maxiFLOW™ design features a **tapered fin structure**. This design: * Maximizes surface area for heat dissipation. * Reduces pressure drop, allowing air to flow more efficiently through the fins. * Is optimized for high-density electronic packaging where airflow might be constrained. #### B. pushPIN™ Attachment System This specific model uses a specialized mounting mechanism: * **Compression Springs:** Ensures uniform pressure across the component (TIM) for better heat transfer. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the PCB. * **Reliability:** It is designed to withstand shock and vibration better than simple adhesive tapes. #### C. Thermal Interface Material (TIM) The **"C1"** in the suffix typically indicates that the part comes with a pre-applied **Thermal Interface Material**. * This eliminates the need for manual application of thermal grease. * Ensures a low-resistance thermal path between the semiconductor die and the aluminum base. --- ### 3. Typical Applications The ATS-55170K-C1-R0 is commonly used to cool small, high-heat components including: * **FPGAs & ASICs:** Custom logic chips in networking equipment. * **Processors:** High-speed embedded CPUs. * **Power Modules:** Voltage regulators that generate significant heat in a small footprint (17x17mm). --- ### 4. Thermal Performance Comparison | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 2.60 | | 300 (1.5 m/s) | 2.10 | | 400 (2.0 m/s) | 1.80 |