## Technical Overview: ATS-55190K-C2-R0 The **ATS-55190K-C2-R0** is a high-performance heat sink assembly manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components such as processors, FPGAs, and ASICs that generate significant heat in constrained spaces. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions** | 19.00mm x 19.00mm | | **Height** | 14.50mm | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | maxiGRIP™ (Compression Clip) | | **Thermal Resistance** | 6.80 °C/W (at 200 LFM) | | **Interface Material** | T766 (Thermal Tape/Pad) | --- ### 2. Component Breakdown #### A. The Heat Sink Body (maxiFLOW™ Design) The heat sink features a **tapered fin design**. This geometry is engineered to: * Increase the surface area for heat dissipation. * Maximize airflow through the fin field. * Reduce pressure drop, making it efficient even in systems with lower fan speeds. #### B. The Attachment System (maxiGRIP™) Unlike traditional heat sinks that require holes drilled into the PCB, this part uses the **maxiGRIP™** attachment mechanism: * **Plastic Frame Clip:** A high-tension clip that surrounds the component. * **Steady Pressure:** It applies uniform pressure across the thermal interface, ensuring optimal heat transfer without risking damage to the silicon die. * **Removability:** It allows for the heat sink to be detached and reattached for maintenance or rework. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766 thermal phase-change material**. This layer fills the microscopic air gaps between the component surface and the heat sink base, significantly lowering the thermal contact resistance. --- ### 3. Applications This specific part is used in electronics where high-density packaging is required: * **Networking Gear:** Switches and routers. * **Telecommunications:** Base stations and signal processing boards. * **Embedded Systems:** Industrial PCs and automation controllers. --- ### 4. Thermal Performance Comparison (Estimated) | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.80 | | 300 (1.5 m/s) | 5.40 | | 400 (2.0 m/s) | 4.70 | ---