The **ATS-55210R-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, which is specifically designed to provide high thermal performance in environments with constrained airflow. --- ### 1. Technical Specifications Below are the primary technical parameters for the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-55210R-C1-R0 | | **Heat Sink Type** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Anodized Blue) | | **Thermal Resistance** | 3.50°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 21mm x 21mm x 19.5mm | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that increases the surface area for cooling while reducing the pressure drop across the component. * **pushPIN™ Attachment:** This model utilizes the pushPIN™ mounting system, which includes a flexible hardware kit. It ensures a secure fit with the PCB and provides a consistent "clamping force" for optimal thermal interface material (TIM) performance. * **Thermal Interface Material (TIM):** The part usually comes pre-applied with a high-performance thermal pad (specifically the **SA-708**), simplifying the assembly process. --- ### 3. Application Use Cases This specific part is typically used in small-form-factor electronics where space is limited but heat generation is high. * **FPGA & ASICs:** Cooling high-speed processing chips. * **Networking:** Used in routers and switches for core processors. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling voltage regulators or small power MOSFETs. --- ### 4. Thermal Performance Comparison The effectiveness of the heat sink varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 3.50 | | 300 | 2.80 | | 400 | 2.40 | | 500 | 2.20 | ---