ATS-55300W-C2-R0
AI

The **ATS-55300W-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed specifically for cooling electronic components like CPUs, GPUs, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 24.50mm |
| **Fin Style** | Straight Fin |
| **Attachment Method** | superGRIP (Clip-on) |
| **Thermal Resistance** | ~3.30 °C/W (at 200 LFM) |
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### 2. Key Electronic Components & Design
The "Electronic" aspect of this part refers to its integration into PCB assemblies. Below are the critical design elements:
#### A. Thermal Interface Material (TIM)
The part usually comes pre-applied with a high-performance thermal pad or phase-change material on the base. This ensures maximum heat transfer from the electronic chip's die to the aluminum fins by eliminating air gaps.
#### B. superGRIP™ Attachment System
Unlike traditional heat sinks that require holes drilled into the PCB, this part uses a frame clip and a spring clip:
* **Plastic Frame:** Fits around the perimeter of the electronic component.
* **Metal Clip:** Applies steady downward pressure (Normal Force) to maintain contact without damaging the solder balls (BGA) underneath the chip.
#### C. Fin Geometry
The straight-fin design is optimized for **forced-air cooling**. In electronic enclosures where a fan provides a consistent directional airflow, the spacing between these fins allows for minimal pressure drop while maximizing surface area for heat dissipation.
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### 3. Applications
This part is commonly found in the following electronic sectors:
* **Telecommunications:** Cooling high-speed network processors.
* **Embedded Systems:** Industrial PCs and controllers.
* **Automotive:** Electronic Control Units (ECUs) and Infotainment processors.
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What are the advantages of the superGRIP attachment over traditional thermal adhesive?
- ⤷ How does the 'Blue Anodized' finish affect the thermal performance of this heat sink?
- ⤷ Is this heat sink compatible with standard BGA chip footprints?