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  • ATS-55300W-C2-R0

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    The **ATS-55300W-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed specifically for cooling electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 24.50mm | | **Fin Style** | Straight Fin | | **Attachment Method** | superGRIP (Clip-on) | | **Thermal Resistance** | ~3.30 °C/W (at 200 LFM) | --- ### 2. Key Electronic Components & Design The "Electronic" aspect of this part refers to its integration into PCB assemblies. Below are the critical design elements: #### A. Thermal Interface Material (TIM) The part usually comes pre-applied with a high-performance thermal pad or phase-change material on the base. This ensures maximum heat transfer from the electronic chip's die to the aluminum fins by eliminating air gaps. #### B. superGRIP™ Attachment System Unlike traditional heat sinks that require holes drilled into the PCB, this part uses a frame clip and a spring clip: * **Plastic Frame:** Fits around the perimeter of the electronic component. * **Metal Clip:** Applies steady downward pressure (Normal Force) to maintain contact without damaging the solder balls (BGA) underneath the chip. #### C. Fin Geometry The straight-fin design is optimized for **forced-air cooling**. In electronic enclosures where a fan provides a consistent directional airflow, the spacing between these fins allows for minimal pressure drop while maximizing surface area for heat dissipation. --- ### 3. Applications This part is commonly found in the following electronic sectors: * **Telecommunications:** Cooling high-speed network processors. * **Embedded Systems:** Industrial PCs and controllers. * **Automotive:** Electronic Control Units (ECUs) and Infotainment processors.
    ✨ Follow-up Questions
    • ⤷ What are the advantages of the superGRIP attachment over traditional thermal adhesive?
    • ⤷ How does the 'Blue Anodized' finish affect the thermal performance of this heat sink?
    • ⤷ Is this heat sink compatible with standard BGA chip footprints?