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  • ATS-55310D-C2-R0

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    The **ATS-55310D-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Overall Dimensions** | 31mm x 31mm | | **Height** | 9.50 mm | | **Thermal Resistance** | 5.30°C/W (at 200 LFM) | | **Flow Pattern** | maxiFLOW (Tapered Fin Design) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features #### A. maxiFLOW™ Fin Geometry Unlike standard straight-fin heat sinks, the maxiFLOW design uses a **tapered fin** structure. This increases the surface area available for heat dissipation while reducing the pressure drop, allowing air to move more freely through the fins. #### B. pushPIN™ Attachment This part utilizes a "pushPIN" mounting system. This provides several advantages for circuit board assembly: * **Uniform Pressure:** Ensures consistent contact between the heat sink and the chip. * **Tool-less Installation:** Fastens into pre-drilled holes on the PCB via a spring-loaded mechanism. * **Reliability:** Highly resistant to shock and vibration. #### C. Pre-Applied Thermal Interface (TIM) The unit comes with **T766 phase-change material** pre-applied to the base. This eliminates the need for manual thermal paste application, ensuring a clean, high-performance thermal bond between the electronic part and the aluminum. --- ### 3. Electronic Applications The ATS-55310D-C2-R0 is typically used in the following electronic environments: * **Telecommunications:** Cooling signal processors in networking switches. * **Embedded Systems:** Small form-factor boards where vertical height is limited (9.5mm). * **Automotive:** Electronic Control Units (ECUs) requiring robust vibration resistance. ---
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole requirements for the pushPIN mounting system?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ What is the maximum power dissipation (in Watts) this heat sink can handle safely?