ATS-55310D-C2-R0
AI

The **ATS-55310D-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table highlights the core physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Anodized Blue) |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Overall Dimensions** | 31mm x 31mm |
| **Height** | 9.50 mm |
| **Thermal Resistance** | 5.30°C/W (at 200 LFM) |
| **Flow Pattern** | maxiFLOW (Tapered Fin Design) |
| **Thermal Interface (TIM)** | T766 (Pre-applied) |
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### 2. Key Design Features
#### A. maxiFLOW™ Fin Geometry
Unlike standard straight-fin heat sinks, the maxiFLOW design uses a **tapered fin** structure. This increases the surface area available for heat dissipation while reducing the pressure drop, allowing air to move more freely through the fins.
#### B. pushPIN™ Attachment
This part utilizes a "pushPIN" mounting system. This provides several advantages for circuit board assembly:
* **Uniform Pressure:** Ensures consistent contact between the heat sink and the chip.
* **Tool-less Installation:** Fastens into pre-drilled holes on the PCB via a spring-loaded mechanism.
* **Reliability:** Highly resistant to shock and vibration.
#### C. Pre-Applied Thermal Interface (TIM)
The unit comes with **T766 phase-change material** pre-applied to the base. This eliminates the need for manual thermal paste application, ensuring a clean, high-performance thermal bond between the electronic part and the aluminum.
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### 3. Electronic Applications
The ATS-55310D-C2-R0 is typically used in the following electronic environments:
* **Telecommunications:** Cooling signal processors in networking switches.
* **Embedded Systems:** Small form-factor boards where vertical height is limited (9.5mm).
* **Automotive:** Electronic Control Units (ECUs) requiring robust vibration resistance.
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- ⤷
What are the specific PCB hole requirements for the pushPIN mounting system?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ What is the maximum power dissipation (in Watts) this heat sink can handle safely?