ATS-55350D-C2-R0
AI

The **ATS-55350D-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs.
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### 1. Technical Specifications
Below are the primary technical parameters for the ATS-55350D-C2-R0:
| Feature | Specification |
| :--- | :--- |
| **Product Series** | maxiFLOW™ |
| **Material** | Aluminum (with Blue Anodized finish) |
| **Attachment Method** | Push Pin (Plastic/Brass) |
| **Thermal Resistance** | 1.40°C/W (at 200 LFM) |
| **Dimension (L x W)** | 35mm x 35mm |
| **Height** | 9.50mm |
| **Interface Material** | T766 (Thermal Tape) |
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### 2. Design Characteristics
The design of this part focuses on maximizing surface area while minimizing airflow resistance.
* **Finned Design:** It features a tapered fin structure (maxiFLOW™) that increases the surface area for heat dissipation. The design is optimized for high-velocity airflow environments.
* **Attachment Mechanism:** It utilizes a **Push Pin** system with a compression spring. This ensures a secure, high-pressure attachment to the PCB, which improves the thermal interface contact between the component and the heat sink.
* **Thermal Interface Material (TIM):** It comes pre-applied with a thermal tape (T766), which simplifies the assembly process and ensures efficient heat transfer from the electronic chip to the aluminum base.
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### 3. Applications
This part is typically found in hardware where space is limited but heat density is high:
1. **Networking Equipment:** Routers, switches, and base stations.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Computing:** High-speed memory modules or secondary processing units.
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### 4. Comparison of Airflow Performance
Performance varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans:
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 200 | 1.0 | 1.40 |
| 300 | 1.5 | 1.10 |
| 400 | 2.0 | 0.90 |
| 500 | 2.5 | 0.80 |
- ⤷What is the difference between the C1 and C2 versions of this heat sink?
- ⤷ Can this heat sink be used with a custom clip instead of push pins?
- ⤷ How do I calculate if the 1.40°C/W resistance is sufficient for my chip?