Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-55350D-C2-R0

  • AI
    The **ATS-55350D-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications Below are the primary technical parameters for the ATS-55350D-C2-R0: | Feature | Specification | | :--- | :--- | | **Product Series** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 1.40°C/W (at 200 LFM) | | **Dimension (L x W)** | 35mm x 35mm | | **Height** | 9.50mm | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Design Characteristics The design of this part focuses on maximizing surface area while minimizing airflow resistance. * **Finned Design:** It features a tapered fin structure (maxiFLOW™) that increases the surface area for heat dissipation. The design is optimized for high-velocity airflow environments. * **Attachment Mechanism:** It utilizes a **Push Pin** system with a compression spring. This ensures a secure, high-pressure attachment to the PCB, which improves the thermal interface contact between the component and the heat sink. * **Thermal Interface Material (TIM):** It comes pre-applied with a thermal tape (T766), which simplifies the assembly process and ensures efficient heat transfer from the electronic chip to the aluminum base. --- ### 3. Applications This part is typically found in hardware where space is limited but heat density is high: 1. **Networking Equipment:** Routers, switches, and base stations. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Computing:** High-speed memory modules or secondary processing units. --- ### 4. Comparison of Airflow Performance Performance varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 1.40 | | 300 | 1.5 | 1.10 | | 400 | 2.0 | 0.90 | | 500 | 2.5 | 0.80 |
    ✨ Follow-up Questions
    • ⤷What is the difference between the C1 and C2 versions of this heat sink?
    • ⤷ Can this heat sink be used with a custom clip instead of push pins?
    • ⤷ How do I calculate if the 1.40°C/W resistance is sufficient for my chip?