The **ATS-55350R-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling electronic components like processors, FPGAs, and ASICs in high-airflow environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35mm x 35mm x 9.5mm | | **Thermal Resistance** | 3.50°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Heat Dissipation Geometry The component features a **flared-fin design**. Unlike standard straight-fin heat sinks, the flared fins increase the surface area and create more turbulence in the airflow, which significantly improves thermal performance in forced-air systems. #### B. pushPIN™ Attachment This part uses a specific mounting mechanism called **pushPIN™**. This is critical for electronic PCB assemblies because: * It ensures a precise and consistent **pressure** on the chip, which is necessary for optimal thermal contact. * The built-in compression springs prevent the heat sink from shifting or damaging the die during vibration or shock. #### C. Thermal Interface Material (TIM) The "C2" in the part number refers to the pre-applied **T766 thermal phase-change material**. This eliminates the need for manual thermal paste application during the assembly process, ensuring a clean and efficient thermal path between the electronic component and the aluminum heat sink. --- ### 3. Common Applications This heat sink is typically found in high-density electronic environments, including: * **Networking Equipment:** Routers, switches, and base stations. * **Computing:** Embedded systems and industrial PCs. * **Power Electronics:** Cooling MOSFETs or power modules.