The **ATS-55400W-C2-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, specifically designed for cooling electronic components such as BGAs (Ball Grid Arrays). --- ## 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | superGRIP™ | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 24.50mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Clip-On (superGRIP) | | **Thermal Resistance** | ~1.60 °C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ## 2. Key Components & Design Features ### A. Material and Coating * **Aluminum Construction:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodizing:** This chemical finish increases corrosion resistance and improves thermal emissivity (radiant heat transfer). ### B. Attachment Mechanism (superGRIP™) The "C2" in the part number refers to the specific attachment style. * **Frame Clip:** A high-strength plastic frame that snaps onto the component perimeter. * **Spring Clip:** A metal "U" shaped spring that applies constant pressure to the heat sink, ensuring a tight interface with the chip. * **No Holes Required:** Unlike traditional heat sinks, this does not require holes in the PCB, preserving board real estate. ### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates the inclusion of a high-performance **Phase Change Material (PCM)** or a thermal pad pre-applied to the base of the heat sink. This fills microscopic air gaps between the component and the sink. --- ## 3. Application Use Cases This specific heat sink is designed for medium-to-high power electronic devices: 1. **Processors:** CPUs, GPUs, and high-end FPGAs. 2. **Networking:** High-speed routers and switch silicon. 3. **Telecommunications:** Base station power management chips. 4. **Industrial:** Embedded computing boards where vibration resistance is necessary. ---