The **ATS-56006-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" product line, specifically designed for high-density electronic cooling applications such as BGA (Ball Grid Array) components. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Dimensions (L x W x H)** | 56.0mm x 56.0mm x 6.0mm | | **Thermal Resistance** | 2.50 °C/W @ 200 LFM | | **Airflow Path** | Low Profile (Fluted Fin Design) | | **Compliance** | RoHS and REACH Compliant | --- ## 2. Key Electronic & Mechanical Parts ### A. The Heat Sink Body The body is constructed from extruded aluminum with a specialized **fluted fin design**. This geometry maximizes the surface area while maintaining a low profile, which is critical for components used in 1U or 2U rack servers where vertical space is limited. ### B. maxiGRIP™ Attachment System Unlike traditional heat sinks that use messy thermal epoxies or permanent adhesives, this part utilizes the **maxiGRIP™ system**, which consists of: * **Plastic Frame Clip:** A high-strength clip that snaps onto the perimeter of the electronic component (e.g., a CPU, FPGA, or GPU). * **Steady-Spring:** A stainless steel spring clip that applies uniform pressure across the heat sink, ensuring optimal contact with the semiconductor surface. ### C. Thermal Interface Material (TIM) The "R0" designation typically indicates that the part comes pre-assembled with a **Thermal Interface Material** (usually a phase-change material or a high-performance pad) on the base. This eliminates the need for manual thermal paste application during assembly. --- ## 3. Ideal Applications Because of its dimensions and thermal efficiency, this part is commonly used for: 1. **Network Switches/Routers:** Cooling high-speed ASICs. 2. **Embedded Computing:** Protecting industrial processors from thermal throttling. 3. **Telecommunications:** Cooling radio frequency (RF) components. ---