The **ATS-56009-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product series, designed to provide high-efficiency cooling for high-power electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 56mm x 56mm x 9mm | | **Attachment Method** | pushPIN™ (Plastic or Brass) | | **Thermal Resistance** | 3.50 °C/W (at 200 LFM) | | **Flow Pattern** | maxiFLOW™ (Open fin design) | | **Compliance** | RoHS Compliant | --- ### 2. Key Features * **maxiFLOW™ Geometry:** The unique spread-fin design increases the surface area for maximum heat dissipation while maintaining low pressure drop. * **pushPIN™ Attachment:** It features a specialized mounting system that includes a high-performance thermal interface material (TIM) pre-applied to the base. * **Low Profile:** With a height of only 9mm, it is ideal for space-constrained applications like 1U chassis or blade servers. * **Versatile Cooling:** Specifically engineered for air-cooled environments where airflow might be limited or irregular. --- ### 3. Electronic Applications This heat sink is typically found in high-reliability industrial and communication electronics, including: 1. **ASIC/FPGA Cooling:** Used on high-gate-count chips found in networking switches and routers. 2. **Power Electronics:** Cooling for DC-DC converters and high-density power modules. 3. **Embedded Computing:** Protecting CPUs and GPUs in industrial PCs and telecommunications hardware. --- ### 4. Thermal Performance Comparison Below is an estimation of thermal resistance based on airflow (LFM - Linear Feet per Minute): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 5.20 | | 200 | 3.50 | | 300 | 2.80 | | 400 | 2.30 | ---