The **ATS-56010-C1-R0** is a high-performance heat sink component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, GPUs, FPGAs, and ASICs in air-cooled environments. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 56mm x 56mm x 10mm | | **Material** | Anodized Aluminum (Blue) | | **Thermal Resistance** | 1.40 °C/W (@ 200 LFM) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Interface Material** | T766 (Thermal Tape/Pad) | --- ### 2. Key Design Components #### A. Fin Geometry (maxiFLOW™) The "maxiFLOW" design features a flared fin geometry. Unlike standard straight-fin heat sinks, the flared fins increase the effective surface area for heat dissipation and improve airflow through the fin field, reducing pressure drop. #### B. Attachment System (maxiGRIP™) This part utilizes the **maxiGRIP™** attachment mechanism, which consists of two main pieces: 1. **Plastic Frame Clip:** Reaches around the component and snaps onto the PCB. 2. **Metal Spring Clip:** A "steady-force" spring that applies consistent pressure across the center of the heat sink to ensure optimal contact with the electronic chip. #### C. Thermal Interface Material (TIM) The model comes pre-applied with **T766** phase-change material or high-performance thermal tape. This fills the microscopic air gaps between the component surface and the heat sink base, significantly lowering thermal impedance. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic sectors: * **Telecommunications:** Cooling high-speed switching silicon. * **Data Centers:** Thermal management for server processors. * **Industrial PC:** Cooling embedded chips in fan-assisted enclosures. * **Networking:** Used on routers and high-bandwidth interface cards. --- ### 4. Thermal Performance Comparison The performance of the ATS-56010-C1-R0 varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 1.40 | | 300 | 1.10 | | 400 | 0.90 | | 500 | 0.80 |