The **ATS-60002-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling high-power electronic components, typically integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part belongs to the **maxiFLOW™** series, known for its unique flared fin design which maximizes airflow and surface area. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-60002-C1-R0 | | **Material** | Aluminum (Anodized Finish) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Thermal Resistance** | ~1.40 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Interface Material** | Pre-applied T766 (Phase Change) | --- ### 2. Key Components & Design Features #### A. Flared Fin Geometry Unlike standard straight-fin heat sinks, the "maxiFLOW" design uses fins that flare outward. This reduces pressure drop and allows for better air intake from multiple directions, significantly improving cooling efficiency in constrained spaces. #### B. maxiGRIP™ Attachment System This part uses a specialized mechanical attachment rather than permanent adhesive: - **Plastic Frame Clip:** Replaces the need for holes in the PCB. - **Stainless Steel Spring Clip:** Provides constant, high-pressure contact between the heat sink and the chip to ensure optimal thermal transfer. - **Reliability:** It is designed to withstand high vibration and shock (MIL-STD-810 compliant). #### C. Thermal Interface Material (TIM) The "C1" designation typically refers to the pre-applied **T766 phase-change material**. When the component heats up, this material softens to fill microscopic air gaps between the chip and the heat sink, lowering the contact resistance. --- ### 3. Application Use Cases The ATS-60002-C1-R0 is commonly used in: * **Networking Hardware:** High-speed routers and switches. * **Industrial Computing:** Embedded systems requiring passive or active cooling. * **Telecommunications:** Base stations and signal processing units. --- ### 4. Thermal Performance Comparison (Example) *Estimation of performance based on airflow (LFM - Linear Feet per Minute):* ```markdown Airflow (LFM) | Thermal Resistance (°C/W) --------------|------------------------- 200 LFM | 1.40 400 LFM | 1.10 600 LFM | 0.90 ``` ---