The **ATS-61330R-C1-R0** is a high-performance heat sink assembly manufactured by Advanced Thermal Solutions (ATS). This part is specifically engineered for cooling electronic components, primarily integrated circuits (ICs) and surface-mount devices (SMDs) in high-airflow environments. --- ### Technical Specifications | Parameter | Specification | Details | | :--- | :--- | :--- | | **Part Number** | ATS-61330R-C1-R0 | Series: maxiFLOW™ | | **Material** | Aluminum | Blue Anodized finish | | **Dimensions** | 33mm x 33mm x 19.5mm | Height includes the base and fins | | **Attachment Method** | maxiGRIP™ | Plastic clip and stainless steel spring | | **Thermal Resistance** | 2.50 °C/W | Rated at 200 LFM (Linear Feet per Minute) | | **Interface Material** | T766 | Pre-applied high-performance thermal pad | --- ### Key Design Features #### 1. maxiFLOW™ Fin Geometry The fin design is the standout feature of this component. Unlike standard straight-fin heat sinks, the maxiFLOW™ profile features a tapered fin design. * **Efficiency:** It increases the surface area while minimizing pressure drop. * **Airflow:** It is designed to capture airflow from multiple directions, making it ideal for crowded PCB environments. #### 2. maxiGRIP™ Attachment System This part utilizes a "Steady State" mechanical attachment system rather than permanent adhesives. * **The Frame:** A plastic frame (clip) surrounds the component. * **The Spring:** A stainless steel "X-clip" provides consistent downward pressure (approximately 15-20 PSI). * **Benefit:** This allows for easy removal and re-work without damaging the PCB or the component, and it meets rigorous shock and vibration standards (Telcordia). #### 3. Thermal Interface Material (TIM) The unit comes with **Chomerics T766** pre-applied to the base. * This material fills the microscopic air gaps between the heat sink and the chip to ensure maximum heat transfer. * It eliminates the need for manual application of thermal paste during assembly. --- ### Application Use-Cases * **Processors & FPGAs:** Ideal for BGA (Ball Grid Array) packages used in networking and telecommunications. * **High-Density Boards:** Used where space is tight and high-velocity cooling fans are present. * **Industrial Computing:** Suited for environments where vibration might cause traditional adhesive-mounted heat sinks to fail.