The **ATS-61375R-C1-R0** is a high-performance heat sink assembly manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, specifically designed for cooling high-power electronic components like CPUs, FPGAs, and ASICs. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Black Anodized) | | **Thermal Resistance** | 0.8 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 37.0 mm x 37.0 mm x 24.5 mm | | **Attachment Method** | maxiGRIP™ (Steady pressure clip) | | **Thermal Interface (TIM)** | Saint-Gobain Phase Change (pre-applied) | | **Application** | BGA (Ball Grid Array) Cooling | --- ## 2. Key Electronic & Design Components ### A. maxiFLOW™ Fin Geometry Unlike traditional straight-fin heat sinks, the ATS-61375R uses a **flared-fin design**. This increases the surface area for heat dissipation and improves air intake from all directions, which is critical in densely packed electronic enclosures where airflow may be turbulent or restricted. ### B. maxiGRIP™ Attachment System This is a critical mechanical part for the electronics. It consists of a two-part system: 1. **Plastic Frame Clip:** A high-temperature plastic frame that snaps around the BGA component. 2. **Stainless Steel Spring Clip:** A "M-shaped" wire clip that applies steady, uniform pressure across the component. This ensures the thermal interface material (TIM) performs at peak efficiency without damaging the solder balls of the BGA under the chip. ### C. Phase Change Thermal Interface (TIM) The bottom of the heat sink is pre-coated with a **Saint-Gobain phase change material**. * **Function:** At room temperature, it is solid for easy handling. * **Performance:** Once the electronic component reaches operating temperature, the material melts and flows into the microscopic gaps between the chip die and the heat sink, significantly reducing thermal resistance compared to standard pads. --- ## 3. Applications This part is typically found in the following electronic systems: * **Telecommunications:** Networking switches and routers. * **Computing:** Embedded servers and industrial PCs. * **Power Supplies:** Cooling MOSFET arrays or power modules. ---