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  • ATS-61400D-C1-R0

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    The **ATS-61400D-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for high-density electronic cooling. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Length (L)** | 40.00 mm | | **Width (W)** | 40.00 mm | | **Height (H)** | 9.50 mm | | **Thermal Resistance** | 2.50 °C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | maxiFLOW (Tapered Fin Design) | --- ### 2. Key Electronic Functions While the heat sink itself does not process data, it performs critical physical roles in an electronic circuit: 1. **Heat Dissipation:** It increases the surface area of high-heat components (like CPUs, FPGAs, or MOSFETs), allowing for more efficient heat transfer to the surrounding air. 2. **Thermal Stability:** By maintaining a lower junction temperature ($T_j$), it ensures that semiconductor components operate within their safe operating area (SOA), preventing thermal throttling or permanent damage. 3. **EMI Shielding (Partial):** Because it is a grounded metal mass (when attached correctly), it can sometimes assist in reducing Electromagnetic Interference (EMI) for the chip it covers. --- ### 3. Components of the Assembly The ATS-61400D-C1-R0 is typically sold as an assembly consisting of: * **The Heat Sink Body:** High-aspect-ratio fins for maximum airflow. * **pushPIN™ Fasteners:** Brass or plastic pins with a stainless steel spring to provide precise pressure on the electronic package. * **Thermal Interface Material (TIM):** Pre-applied phase-change material or thermal grease on the base to fill microscopic air gaps between the heat sink and the chip. --- ### 4. Ideal Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Network switches and high-speed routers. * **Power Electronics:** Voltage regulators and power modules.
    ✨ Follow-up Questions
    • ⤷ What are the different pushPIN attachment options available for this series?
    • ⤷ How does the maxiFLOW fin design compare to standard straight-fin heat sinks?
    • ⤷ What type of Thermal Interface Material is pre-applied to the ATS-61400D-C1-R0?