ATS-61400D-C1-R0
AI

The **ATS-61400D-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for high-density electronic cooling.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Length (L)** | 40.00 mm |
| **Width (W)** | 40.00 mm |
| **Height (H)** | 9.50 mm |
| **Thermal Resistance** | 2.50 °C/W (at 200 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Style** | maxiFLOW (Tapered Fin Design) |
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### 2. Key Electronic Functions
While the heat sink itself does not process data, it performs critical physical roles in an electronic circuit:
1. **Heat Dissipation:** It increases the surface area of high-heat components (like CPUs, FPGAs, or MOSFETs), allowing for more efficient heat transfer to the surrounding air.
2. **Thermal Stability:** By maintaining a lower junction temperature ($T_j$), it ensures that semiconductor components operate within their safe operating area (SOA), preventing thermal throttling or permanent damage.
3. **EMI Shielding (Partial):** Because it is a grounded metal mass (when attached correctly), it can sometimes assist in reducing Electromagnetic Interference (EMI) for the chip it covers.
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### 3. Components of the Assembly
The ATS-61400D-C1-R0 is typically sold as an assembly consisting of:
* **The Heat Sink Body:** High-aspect-ratio fins for maximum airflow.
* **pushPIN™ Fasteners:** Brass or plastic pins with a stainless steel spring to provide precise pressure on the electronic package.
* **Thermal Interface Material (TIM):** Pre-applied phase-change material or thermal grease on the base to fill microscopic air gaps between the heat sink and the chip.
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### 4. Ideal Applications
* **Embedded Systems:** Industrial PCs and controllers.
* **Telecommunications:** Network switches and high-speed routers.
* **Power Electronics:** Voltage regulators and power modules.
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What are the different pushPIN attachment options available for this series?
- ⤷ How does the maxiFLOW fin design compare to standard straight-fin heat sinks?
- ⤷ What type of Thermal Interface Material is pre-applied to the ATS-61400D-C1-R0?