The **ATS-61400R-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as processors, FPGAs, and ASICs that require efficient thermal management in tight spaces. --- ## 1. Technical Specifications The part belongs to the **maxiFLOW™** series, which features a flared fin design to maximize surface area and increase airflow. | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-61400R-C1-R0 | | **Thermal Resistance** | 1.10°C/W (at 200 LFM) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Fin Style** | Flared | | **Material** | Aluminum (Black Anodized) | | **Dimensions** | 40mm x 40mm x 19.5mm | --- ## 2. Key Features ### A. maxiFLOW™ Design The "flared" fin geometry is the signature of this part. Unlike standard straight-fin heat sinks, the fins on this model curve outward. This allows it to capture more air from high-velocity sources and improves cooling performance in environments where airflow is not perfectly aligned with the heat sink. ### B. maxiGRIP™ Attachment System This part utilizes a specialized mechanical attachment rather than thermal tape or epoxy: * **Plastic Frame Clip:** A high-tension frame clips around the component. * **Steady Pressure:** It applies constant pressure to the thermal interface material (TIM) to ensure optimal heat transfer. * **Non-Destructive:** It can be removed and reapplied without damaging the PCB. ### C. Thermal Interface Material (TIM) The "C1" in the part number usually indicates that it comes pre-applied with a **Phase Change Material (PCM)**. This material stays solid at room temperature but melts and fills microscopic gaps when the component heats up, significantly reducing thermal resistance. --- ## 3. Applications The ATS-61400R-C1-R0 is commonly used in: * **Networking Equipment:** High-speed routers and switches. * **Telecommunications:** Base stations and signal processing units. * **Embedded Systems:** Industrial computers and high-end IoT gateways. ---