The **ATS-61450D-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed for cooling high-density electronic packages like BGA (Ball Grid Array) components. --- ### ## Technical Specifications Below are the primary electronic and physical specifications for the part: | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-61450D-C1-R0 | | **Heat Sink Type** | maxiFLOW™ (Flared Fin Design) | | **Material** | Aluminum (Black Anodized Finish) | | **Thermal Resistance** | 1.10 °C/W @ 200 LFM (Linear Feet per Minute) | | **Dimensions** | 45.00mm x 45.00mm x 9.50mm | | **Attachment Method** | maxiGRIP™ (Frame Clip & Spring) | | **Thermal Interface** | Pre-applied T766 Phase Change Material | --- ### ## Key Electronic Features #### 1. Flared Fin Geometry The "maxiFLOW" design features fins that flare outward. In electronic systems with high-density PCB layouts, this geometry: * Reduces pressure drop. * Increases the surface area for heat dissipation. * Maximizes airflow through the heat sink in restricted spaces. #### 2. maxiGRIP™ Attachment System This is a mechanical attachment mechanism that avoids the need for drilling holes in the PCB. It uses: * **Plastic Frame Clip:** Secures the heat sink to the electronic component. * **Stainless Steel Spring:** Provides constant pressure to ensure optimal contact with the semiconductor die. * **Safety:** Prevents damage to the BGA solder joints during vibration or shipping. #### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a phase-change material that melts when the electronic component reaches its operating temperature, filling microscopic air gaps between the component and the heat sink to ensure maximum heat transfer. --- ### ## Applications in Electronics This specific part is typically used for cooling: * **ASICs and FPGAs:** High-power logic chips in networking equipment. * **Processors:** Embedded CPUs in industrial computing. * **Communication Modules:** High-speed data transceivers that generate significant heat in a small footprint. ---