The **ATS-H1-151-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and high-power MOSFETs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 6.50°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Style** | Straight Fin (High Density) | | **Interface Material** | T766 Phase Change Material (Pre-applied) | --- ### 2. Key Design Components #### A. Fin Geometry The "H1" in the part number indicates a specific fin pattern. These straight fins are optimized for **forced-air convection**. The narrow spacing increases the surface area for heat dissipation but requires a fan to push air through the channels effectively. #### B. Push Pin Attachment Unlike adhesive tapes or clips, this model uses a **spring-loaded push pin system**. - **Security:** Provides constant pressure for better contact with the component. - **Reliability:** Prevents the heat sink from shifting under vibration or mechanical shock. - **Mounting:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a phase-change material that softens at operating temperatures to fill microscopic air gaps between the heat sink and the chip, significantly lowering thermal resistance compared to air alone. --- ### 3. Application Use Cases The ATS-H1-151-C3-R0 is typically used in environments where vertical space is restricted (10mm height) but high thermal efficiency is required: * **Networking Equipment:** Routers, switches, and high-speed hubs. * **Industrial PCs:** Compact motherboards and embedded systems. * **Power Supplies:** Cooling voltage regulators and power converters. --- ### 4. Thermal Performance Curve Performance varies based on the Airflow (LFM - Linear Feet per Minute): | Airflow Speed | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM** | 6.50 | | **400 LFM** | 4.30 | | **600 LFM** | 3.50 |