The **ATS-H1-41-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed to provide efficient thermal management for electronic components. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Attachment Type** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 1.00°C/W (at 200 LFM) | | **Airflow Path** | Straight Fin | --- ### Key Components & Design Features #### 1. Heat Sink Body The body is constructed from **Aluminum (6063)**, chosen for its excellent thermal conductivity and lightweight properties. The "Blue Anodized" finish is not just for aesthetics; it provides corrosion resistance and slightly increases the emissivity of the surface. #### 2. Fin Configuration This model features **Straight Fins**. - **Thermal Performance:** The vertical fins maximize the surface area exposed to moving air. - **Airflow compatibility:** It is designed for systems with a defined airflow direction (active cooling). #### 3. Attachment Mechanism (Push Pins) The "R0" designation refers to the mounting hardware. - It uses **pre-drilled holes** in the PCB. - The pins are spring-loaded, ensuring constant pressure (Interface Pressure) between the heat sink and the electronic component (CPU, GPU, or FPGA). - This ensures the thermal interface material (TIM) is compressed correctly for maximum heat transfer. #### 4. Thermal Interface Material (TIM) Most ATS-H1-41-C2-R0 units come with a pre-applied **high-performance thermal phase-change material** or grease. This fills the microscopic air gaps between the component and the heat sink base. --- ### Common Applications The dimensions and thermal resistance make this part ideal for: * **Processors (CPUs):** Embedded systems or low-power desktop chips. * **ASICs & FPGAs:** High-speed integrated circuits used in telecommunications. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators. * **Video Processing:** Cooling chips on high-definition video cards. ---