The **ATS-H1-49-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 35mm x 35mm x 10mm | | **Fin Type** | Straight Fin (High density) | | **Attachment Method** | Push-Pin with Brass Springs | | **Thermal Resistance** | ~11.88 °C/W (at 200 LFM) | | **Thermal Interface** | Pre-applied T766 Phase Change Material | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body Manufactured from **Aluminum 6063**, the part utilizes a straight-fin design. The aluminum provides high thermal conductivity, while the blue anodized finish increases surface emissivity and protects against corrosion. #### B. Push-Pin Attachment Mechanism This part features a **Push-Pin and Brass Spring** system. - **Efficiency:** Unlike adhesive tapes, push-pins provide consistent pressure (preload) between the heat sink and the electronic component. - **Reliability:** The brass springs ensure that thermal expansion/contraction does not loosen the contact. - **Ease of Use:** It requires pre-drilled holes in the PCB for secure mounting. #### C. Thermal Interface Material (TIM) The **C2** designation in the part number indicates the inclusion of **T766 thermal interface material**. This is a high-performance phase-change material that melts at operating temperatures to fill microscopic air gaps, ensuring maximum heat transfer from the component to the aluminum fins. --- ### 3. Comparison with Similar Parts | Feature | ATS-H1-49-C2-R0 | Standard Adhesive Heat Sink | | :--- | :--- | :--- | | **Mounting** | Mechanical Push-Pin | Pressure Sensitive Adhesive (PSA) | | **Heat Transfer** | High (due to spring pressure) | Medium (lower contact pressure) | | **Reusability** | Yes (can be unclipped) | No (tape is one-time use) | | **PCB Requirement** | Requires mounting holes | No holes required | --- ### 4. Application Areas - **Embedded Systems:** Cooling microprocessors in tight enclosures. - **Telecommunications:** Used on high-speed networking chips. - **Industrial Controls:** Managing heat in motor drivers or power modules.