The **ATS-H1-50-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, designed specifically for high-velocity airflow environments to cool electronic components like CPUs, GPUs, FPGAs, or ASICs. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-H1-50-C2-R0 | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 37.00mm x 37.00mm x 10.00mm | | **Thermal Resistance** | 1.90°C/W (at 200 LFM) | | **Airflow Direction** | Horizontal (Designed for ducted airflow) | --- ### 2. Key Design Elements * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that increases the surface area while reducing pressure drop. This allows air to move more freely through the fins, maximizing heat dissipation. * **pushPIN™ Attachment:** This model uses a specialized push-pin system with a built-in compression spring. This ensures: 1. **Uniform Pressure:** Prevents mechanical stress on the delicate silicon die. 2. **Reliability:** Maintains a consistent thermal interface even during shock or vibration. * **Pre-Applied Thermal Interface Material (TIM):** Most units in this series come with **Chomerics T766** phase-change material or a high-performance thermal pad pre-applied to the base, simplifying the assembly process. --- ### 3. Thermal Performance Profile The effectiveness of this heat sink depends heavily on the Airflow (Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 1.90 | | 300 | 1.45 | | 400 | 1.25 | | 500 | 1.10 | --- ### 4. Typical Applications * **Networking Hardware:** Routers, switches, and high-speed gateways. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs or power regulators in compact enclosures.