ATS-H1-58-C2-R0
AI

The **ATS-H1-58-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, and high-power chipsets.
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## 1. Technical Specifications
The following table details the physical and thermal properties of this specific model:
| Property | Specification |
| :--- | :--- |
| **Product Series** | pushPIN™ HS |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 40mm x 40mm x 15mm |
| **Fin Style** | Straight (Fine Pitch) |
| **Attachment Method** | pushPIN™ (Spring Loaded) |
| **Thermal Resistance** | 13.08 °C/W (Unducted Flow @ 100 LFM) |
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## 2. Key Component Features
### A. Material and Design
* **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity.
* **Straight Fin Design:** The "Straight" fin geometry is optimized for directional airflow, ensuring that heat is carried away efficiently by a cooling fan or system ventilation.
### B. The pushPIN™ Attachment System
One of the most critical aspects of this part is the **pushPIN™** mounting mechanism:
* **Secure Fit:** Uses a spring-loaded pin to provide a precise and consistent pressure on the electronic component (TIM - Thermal Interface Material).
* **Hardware:** Includes a brass or plastic pin and a high-performance compression spring.
* **Standard Holes:** Requires pre-drilled holes in the PCB for installation.
### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates the use of **T766** thermal phase change material or grease. This layer fills microscopic gaps between the chip surface and the heat sink base to minimize thermal resistance.
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## 3. Application Use Cases
This part is commonly found in the following electronic environments:
1. **Telecommunications:** For cooling signal processing units.
2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.
3. **Power Electronics:** Voltage regulators and high-speed MOSFETs.
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- ⤷
How does the 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
- ⤷ What is the recommended hole diameter for the pushPIN™ mounting system?
- ⤷ Can this heat sink be used in a passive cooling environment without a fan?