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  • ATS-H1-58-C2-R0

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    The **ATS-H1-58-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, and high-power chipsets. --- ## 1. Technical Specifications The following table details the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Product Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Style** | Straight (Fine Pitch) | | **Attachment Method** | pushPIN™ (Spring Loaded) | | **Thermal Resistance** | 13.08 °C/W (Unducted Flow @ 100 LFM) | --- ## 2. Key Component Features ### A. Material and Design * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Straight Fin Design:** The "Straight" fin geometry is optimized for directional airflow, ensuring that heat is carried away efficiently by a cooling fan or system ventilation. ### B. The pushPIN™ Attachment System One of the most critical aspects of this part is the **pushPIN™** mounting mechanism: * **Secure Fit:** Uses a spring-loaded pin to provide a precise and consistent pressure on the electronic component (TIM - Thermal Interface Material). * **Hardware:** Includes a brass or plastic pin and a high-performance compression spring. * **Standard Holes:** Requires pre-drilled holes in the PCB for installation. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the use of **T766** thermal phase change material or grease. This layer fills microscopic gaps between the chip surface and the heat sink base to minimize thermal resistance. --- ## 3. Application Use Cases This part is commonly found in the following electronic environments: 1. **Telecommunications:** For cooling signal processing units. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Electronics:** Voltage regulators and high-speed MOSFETs. ---
    ✨ Follow-up Questions
    • ⤷ How does the 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
    • ⤷ What is the recommended hole diameter for the pushPIN™ mounting system?
    • ⤷ Can this heat sink be used in a passive cooling environment without a fan?