The **ATS-H1-64-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed for high-velocity airflow environments. ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-H1-64-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 57.00mm x 61.00mm x 25.00mm | | **Thermal Resistance** | 0.81 °C/W (@ 200 LFM) | | **Flow Direction** | Directional (maxiFLOW™ Pattern) | --- ### 2. Key Electronic Features * **MaxiFLOW™ Design:** The sink features a unique spread fin geometry. This increases the surface area for heat dissipation while maintaining low pressure drop, making it ideal for high-density electronic packaging. * **pushPIN™ Attachment:** Instead of using adhesive tape, this model uses a mechanical spring-loaded pin system. This ensures consistent pressure (TIM - Thermal Interface Material compression) and reliable mounting even under vibration or shock. * **Material Efficiency:** The aluminum construction offers a balance between lightweight design and high thermal conductivity. The Blue Anodized finish provides surface protection and improved emissivity. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance thermal phase-change material or grease, ensuring immediate "out-of-the-box" installation. --- ### 3. Common Applications This part is typically used to cool high-power electronic components such as: 1. **CPUs and GPUs** in embedded systems. 2. **ASICs and FPGAs** used in networking hardware (switches/routers). 3. **Power Converters** and industrial control units where vertical space is constrained but airflow is available. --- ### 4. Thermal Performance Comparison Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 0.81 | | 400 (2.0 m/s) | 0.45 | | 600 (3.0 m/s) | 0.30 |