The **ATS-H1-65-C2-R0** is a specific high-performance heat sink model manufactured by **Advanced Thermal Solutions (ATS)**. This component belongs to the **maxiFLOW™** series, designed to provide high thermal performance in environments with constrained airflow. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 37.00mm x 41.00mm x 20.00mm | | **Thermal Resistance** | 2.10 °C/W (at 200 LFM) | | **Airflow Path** | Horizontal (Spread Fin) | | **Weight** | ~40 grams | --- ### 2. Design and Component Breakdown #### A. Fin Geometry (maxiFLOW™) The "H1" in the part number indicates a specific fin pattern. Unlike traditional straight-fin heat sinks, the maxiFLOW™ design features a **tapered fin structure**. This reduces pressure drop and increases surface area, allowing heat to dissipate more efficiently into the surrounding air stream. #### B. The pushPIN™ Attachment System The "C2-R0" designation refers to the mounting hardware. - **Push Pins:** These are pre-assembled with the heat sink to ensure quick and secure attachment to the PCB. - **Compression Springs:** These provide a precise amount of force (clamping pressure) on the electronic component (CPU, GPU, or ASIC) to ensure maximum thermal contact without damaging the board. #### C. Thermal Interface Material (TIM) The "R0" variant typically comes with a pre-applied high-performance **Thermal Interface Material**. This eliminates the need for manual application of thermal paste and ensures there are no microscopic air gaps between the component die and the heat sink base. --- ### 3. Application Use Cases This specific model is used to cool high-heat-generating electronic components such as: * **Field Programmable Gate Arrays (FPGAs)** * **Application-Specific Integrated Circuits (ASICs)** * **Network Processors** * **High-speed Power Supplies** --- ### 4. Part Number Decoder | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **H1** | High-performance fin geometry | | **65** | Heat sink height and footprint code | | **C2** | Color/Finish (Black Anodized) and Mounting Strength | | **R0** | Thermal Interface Material (TIM) code |