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  • ATS-H1-70-C2-R0

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    The **ATS-H1-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Here are the core technical details for this model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ (with Brass Spring) | | **Heat Sink Type** | Straight Fin | | **Thermal Resistance** | ~6.75 °C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Physical Design Features * **Push-Pin Mounting:** This part features a secure push-pin attachment mechanism. This is more reliable than thermal tape and ensures consistent pressure between the heat sink and the electronic chip for better heat transfer. * **High-Performance Springs:** It uses brass springs to provide the exact compression force required to optimize the thermal interface material (TIM) performance. * **Straight Fin Geometry:** The fins are aligned to allow air to pass through linearly. This design is highly effective in systems with forced-air cooling (fans). --- ### 3. Electronic Application This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of networking processors and ASICs. 2. **Embedded Systems:** High-power industrial computers where space is limited but heat generation is high. 3. **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs) or high-speed FPGA chips. --- ### 4. Thermal Performance Comparison (Calculated) Heat sinks are measured by how many degrees Celsius the component's temperature rises per Watt of power consumed. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Low Airflow) | 11.5 | | 300 (Medium Airflow) | 5.0 | | 500 (High Airflow) | 3.8 | ---
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole patterns for the push-pin mounting on this model?
    • ⤷ How does blue anodization affect the thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used with a custom thermal pad or liquid metal?