ATS-H1-70-C2-R0
AI

The **ATS-H1-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS. Here are the core technical details for this model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (High Thermal Conductivity) |
| **Finish** | Blue Anodized |
| **Attachment Method** | push-PIN™ (with Brass Spring) |
| **Heat Sink Type** | Straight Fin |
| **Thermal Resistance** | ~6.75 °C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Compliance** | RoHS and REACH Compliant |
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### 2. Physical Design Features
* **Push-Pin Mounting:** This part features a secure push-pin attachment mechanism. This is more reliable than thermal tape and ensures consistent pressure between the heat sink and the electronic chip for better heat transfer.
* **High-Performance Springs:** It uses brass springs to provide the exact compression force required to optimize the thermal interface material (TIM) performance.
* **Straight Fin Geometry:** The fins are aligned to allow air to pass through linearly. This design is highly effective in systems with forced-air cooling (fans).
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### 3. Electronic Application
This part is typically used in the following electronic environments:
1. **Telecommunications:** Cooling of networking processors and ASICs.
2. **Embedded Systems:** High-power industrial computers where space is limited but heat generation is high.
3. **Power Electronics:** Managing heat for Voltage Regulator Modules (VRMs) or high-speed FPGA chips.
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### 4. Thermal Performance Comparison (Calculated)
Heat sinks are measured by how many degrees Celsius the component's temperature rises per Watt of power consumed.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Low Airflow) | 11.5 |
| 300 (Medium Airflow) | 5.0 |
| 500 (High Airflow) | 3.8 |
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- ⤷
What are the compatible PCB hole patterns for the push-pin mounting on this model?
- ⤷ How does blue anodization affect the thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used with a custom thermal pad or liquid metal?