The **ATS-H1-75-C3-R0** is a high-performance **heat sink** component manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Attachment Method** | Push Pin (with Brass Springs) | | **Fin Style** | Straight Fin (High density) | | **Thermal Resistance** | Variable based on Airflow (LFM) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Features * **High-Efficiency Design:** The straight-fin geometry is optimized for forced convection (active airflow), providing a high surface area for heat dissipation within a small footprint. * **Secure Attachment:** The push pin mechanism uses a pre-drilled hole pattern on the PCB. This ensures consistent pressure across the component surface, which is critical for thermal transfer. * **T412 Interface:** The part comes with a pre-applied thermal tape/pad (T412), which offers high dielectric strength and eliminates the need for separate thermal paste application. * **Blue Anodization:** This finish is not just aesthetic; it provides surface protection against corrosion and increases the emissivity of the material for better heat radiation. --- ### 3. Thermal Performance Profile Thermal resistance ($^\circ \text{C/W}$) decreases as airflow (Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance ($^\circ \text{C/W}$) | | :--- | :--- | :--- | | 200 | 1.0 | ~10.5 | | 400 | 2.0 | ~6.4 | | 600 | 3.0 | ~4.8 | --- ### 4. Implementation Details The **"C3"** in the part number specifically refers to the attachment type and spring force, while the **"R0"** indicates the RoHS compliance and revision status. #### Installation Requirements: * **PCB Hole Diameter:** Typically requires 3.0mm holes. * **Orientation:** Should be placed so that the fins are parallel to the direction of the system's airflow to minimize air resistance. ---